Reservoir effect and maximum allowed VIA misalignment for AlCu interconnect with tungsten VIA plug

Author: Li Y.   Jelle Veenstra K.   Dubois J.   Peters-Wu L.   van Zomeren A.   Kuper F.  

Publisher: Elsevier

ISSN: 0026-2714

Source: Microelectronics Reliability, Vol.43, Iss.9, 2003-09, pp. : 1449-1454

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