Thin-film encapsulation technology for above-IC MEMS wafer-level packaging

By Zhang Qing   Cicek Paul-Vahé   Nabki Frederic   El-Gamal Mourad  

Journal of Micromechanics and Microengineering, Vol. 23, Iss. 12, 2013-12 ,pp. : 125012-125021

IOP Publishing

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Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding

By Bleiker Simon J.   Visser Taklo Maaike M.   Lietaer Nicolas   Vogl Andreas   Bakke Thor   Niklaus Frank  

Micromachines, Vol. 7, Iss. 10, 2016-10 ,pp. : 192-192

MDPI

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A method for wafer level hermetic packaging of SOI-MEMS devices with embedded vertical feedthroughs using advanced MEMS process

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Journal of Micromechanics and Microengineering, Vol. 25, Iss. 12, 2015-12 ,pp. : 125030-125040

IOP Publishing

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Low-temperature thin-film indium bonding for reliable wafer-level hermetic MEMS packaging

By Straessle R   Pétremand Y   Briand D   Dadras M   de Rooij N F  

Journal of Micromechanics and Microengineering, Vol. 23, Iss. 7, 2013-07 ,pp. : 75007-75014

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Wafer-Level Packaging Method for RF MEMS Applications Using Pre-Patterned BCB Polymer

By Gong Zhuhao   Zhang Yulong   Guo Xin   Liu Zewen  

Micromachines, Vol. 9, Iss. 3, 2018-02 ,pp. : 93-93

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