Non-Destructive Detection of Current Distribution in Power Modules based on Pulsed Magnetic Measurement

Author： Busatto G.   Iannuzzo F.   Velardi F.   Valentino M.   Pepe G.P.  

Publisher： Elsevier

ISSN： 0026-2714

Source： Microelectronics Reliability, Vol.43, Iss.9, 2003-09, pp. : 1907-1912

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Non-destructive detection methods for discontinuities of interconnection structures

By Blecha Tomas  

Microelectronics International, Vol. 33, Iss. 1, 2016-01 ,pp. : 23-35

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Non-destructive characterization of strontium bismuth tantalate films

By Petrik P.   Khanh N.Q.   Horvath Z.E.   Zolnai Z.   Barsony I.   Lohner T.   Fried M.   Gyulai J.   Schmidt C.   Schneider C.   Ryssel H.  

Materials Science in Semiconductor Processing, Vol. 5, Iss. 2, 2002-04 ,pp. : 141-145

Elsevier

Access to resources Recommend Favorite

Non-destructive quantitative phase analysis of an LTCC material

By Makarovic Kostja   Meden Anton   Hrovat Marko   Belavic Darko   Holc Janez   Kosec Marija  

Microelectronics International, Vol. 30, Iss. 2, 2013-04 ,pp. : 73-76

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Reliability of low current electrical spring contacts in power modules

By Hornung E.   Scheuermann U.  

Microelectronics Reliability, Vol. 43, Iss. 9, 2003-09 ,pp. : 1859-1864

Elsevier

Access to resources Recommend Favorite

Application of Picosecond Ultrasonics to Non-Destructive Analysis in VLSI circuits

By Andriamonje G.   Pouget V.   Ousten Y.   Lewis D.   Danto Y.   Rampnoux J.M.   Ezzahri Y.   Dilhaire S.   Grauby S.   Claeys W.   Rossignol C.   Audoin B.  

Microelectronics Reliability, Vol. 43, Iss. 9, 2003-09 ,pp. : 1803-1807

Elsevier

Access to resources Recommend Favorite